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Berlin to Host The Future of Electronics RESHAPED in Oct

Ever since the practical applications began after Ambrose Fleming patented the first true thermionic diode and Lee de Forest invented the triode in the early 1900s, electronic devices have significantly influenced the development of many aspects of modern society.

The Future of Electronics RESHAPED, the flagship event of TechBlick – a year round platform for onsite and online conferences, classes, and insights in emerging technologies – will be held in Berlin from 22-23 October 2025. The two-day exhibition-cum-conference will have the global industry join in to take a step further to reshape the future of electronics. The cutting-edge event will attract the global community – from innovators and material suppliers to equipment makers, manufacturers, and end users – who will all gather at Berlin to reshape the future of electronics.

Co-located with the Future of Electronics RESHAPED is Perovskite Connect, the first-ever worldwide event dedicated to the growing perovskite industry. Organised jointly by TechBlick and Perovskite-info, the event is the global home of the printed, flexible, large-area, and roll-to-roll (R2R) electronics industry, including all aspects of ink formulation, coating, printing, inkjetting, and R2R production. This is a highly synergetic event as these technologies will play a key role in the development and volume production of perovskites.

The two-day exhibition-cum-conference will also feature masterclasses and tours, focusing on the transformation of electronics, making it additive, sustainable, flexible, hybrid, wearable, structural, and 3D. The exhibition will provide exceptional networking and engagement opportunities with leading global companies.

The dual events will see the latest updates being unveiled, key conversations happening, and new ideas and projects forged. Attendees will enjoy a curated world-class agenda and masterclass programme, experience and feel the latest technologies and products at 78 booths, and connect with over 600 peers, partners, and customers from around the world.

Confirmed exhibitors include Agfa, Armor Smart Films, Coatema Coating Machinery GmbH, Eastman Kodak Company, Essemtec, FUJI CORPORATION, Henkel, Heraeus Electronics, ImageXpert, Nagase ChemteX America, NanoPrintek, Noctiluca SA, Notion Systems GmbH, Printed Electronics Limited, Sun Chemical, THIEME, and XTPL, among others.

The co-located events will be held at Estrel Congress Center (ECC), one of Berlin’s largest and most modern event venues located in Estrel Berlin, Germany.

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