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BOBST, Partners Hold Successful Roadshows in Turkey

Events in Istanbul and Gaziantep demonstrate latest innovations in flexible packaging and labels; strong attendance at both locations; comprehensive technical presentations cover latest developments in flexible packaging and label production

BOBST, along with leading industry partners, held a successful roadshow event in Turkey, demonstrating latest innovations in flexible packaging and labels. The two-day event series, held in Istanbul and Gaziantep in February 2025, brought together packaging industry professionals from across the Turkish market to explore the latest sustainability-focused solutions and digital technologies.

“The strong attendance at both locations reflects the Turkish packaging industry’s commitment to innovation and sustainability,” says Eric Pavone, Business Director AFMETC Region, BOBST. “By bringing together expertise from across the packaging value chain, we demonstrated how collaboration drives progress in sustainable label and packaging solutions. What’s more, we showed how BOBST is at the very cutting edge of progress, and why this is so important for our customers.”

The events featured comprehensive technical presentations covering the latest developments in flexible packaging and label production. Key focus areas included BOBST’s oneBARRIER technology for recycle-ready mono-material substrates for flexible packaging, as well as digital printing innovations, and the BOBST Connect platform for enhanced connectivity and workflow optimisation.

Industry partners including Esko, Michelman, Miraclon, Reifenhäuser, Sun Chemical, and UPM shared insights on developments ranging from recyclable paper-based solutions to advanced prepress technologies. The partnership approach highlighted how different technologies can synergise to create more advanced sustainable packaging and label solutions.

“Mirroring global trends, the Turkish market is showing strong interest in technologies that combine sustainability with high performance, without making compromises,” says Cihat Ayan, Zone Business Director, BOBST. “This roadshow demonstrated how BOBST and our partners are delivering innovations that help converters meet rapidly changing market demands while enhancing sustainability profiles, whether that’s through recyclability, reducing waste, or driving down business energy use.”

Interactive sessions allowed attendees to explore the latest BOBST technologies, and automated workflow systems. The events also featured live demonstrations of BOBST Connect, showcasing how digitalisation and connectivity can combine to enhance production efficiency.

The roadshow reinforced BOBST’s commitment to driving innovation in the packaging industry through its four strategic pillars: connectivity, digitalisation, automation, and sustainability. The strong turnout and engagement from attendees demonstrated the Turkish market’s appetite for sustainable packaging solutions and digital transformation.

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